Samsung Nears Mass Production of HBM4 Chips for Nvidia, AMD; Aims to Reclaim AI Memory Lead

• Samsung Electronics is set to begin mass production of its next-generation HBM4 memory chips as early as next month, with initial shipments targeting major customers like Nvidia and AMD.
• This move is crucial for Samsung to regain market share in the high-bandwidth memory (HBM) sector for AI, where it has lagged behind rival SK hynix.
• Samsung's strategy involves an industry-first adoption of a sixth-generation 10-nanometer (1c) DRAM process and an advanced 4-nanometer foundry process for the logic die, despite initial low yields.
• The company recently passed final qualification tests for Nvidia and AMD, with its HBM4 chips achieving data transfer speeds of 10.7 Gbps, exceeding Nvidia's 10 Gbps requirement.
• The technical configuration of Samsung's HBM4 offers greater design flexibility and higher input/output speeds compared to competitors, positioning it for next-gen AI accelerators like Nvidia's Rubin platform and AMD's MI450.

Why It Matters: Samsung is poised to mass-produce advanced HBM4 chips for AI giants, aiming to lead the high-bandwidth memory market.