India Aims for Half of Global Chip Design, Vaishnaw Unveils Semicon 2.0 Roadmap

• Union IT and Electronics Minister Ashwini Vaishnaw announced a fresh roadmap to strengthen India's semiconductor ecosystem at the World Economic Forum in Davos.
• Vaishnaw stated that India's position in the global semiconductor space has shifted from skepticism to strong global confidence, with many leaders eager to participate.
• India aims to become a global hub for semiconductor design talent, with 50% of the world's semiconductor design work eventually carried out from India.
• The Semicon 2.0 program includes the upcoming Design Linked Incentive (DLI) 2.0 and focuses on six core design domains: compute systems, RF, cyber-secure networking, power management, sensors, and memory.
• The program also targets developing advanced manufacturing capabilities, including domestic production of 3nm chips by 2032, and will launch Deep Tech Awards for startups.

Why It Matters: India is aggressively positioning itself as a global semiconductor design and manufacturing hub, targeting 50% of global chip design.