SK Hynix to Invest $13 Billion in New Chip Packaging Facility Amid AI Memory Surge

• SK Hynix plans a $12.9 billion investment in a new advanced chip packaging facility in Cheongju, South Korea.
• The investment addresses a global memory chip shortage driven by surging demand for AI applications and high-bandwidth memory (HBM).
• Construction starts in April, with completion expected by late 2027, aiming to meet future high-performance memory needs.
• SK Hynix dominated the HBM market last year with over 61% share, supplying major AI chip providers like Nvidia.
• Industry forecasts predict a 33% CAGR for the HBM market from 2025-2030, with DRAM costs rising significantly.

Why It Matters: SK Hynix is investing $13 billion in a new facility to meet soaring AI memory demand and maintain market leadership.