Paras Defence Enters Semiconductor Sector with New Subsidiary, Plans 3D Packaging Facility

• Paras Defence and Space Technologies Ltd. launched Paras Semiconductor Pvt. Ltd., a new subsidiary focused on advanced semiconductor packaging.
• The subsidiary aims to establish an advanced heterogeneous and 3D packaging OSAT facility for defence and strategic electronics.
• The facility will cater to semiconductor devices for optical and optronic systems, high-performance computing, networking, and data centers.
• This initiative aligns with India's goal of a self-reliant semiconductor ecosystem, emphasizing chiplet integration and SiP technologies.
• Paras Defence will hold a 70% equity stake in the new subsidiary, which has an authorized share capital of ₹10 lakh.

Why It Matters: Paras Defence diversifies into semiconductors with a new subsidiary, focusing on advanced packaging for defence and HPC.