PM Modi to Attend HCL-Foxconn JV Groundbreaking for India Chip Pvt. Ltd.

• Prime Minister Narendra Modi will participate via video conference in the groundbreaking ceremony of the HCL-Foxconn joint venture project, India Chip Pvt. Ltd., on February 21, 2026, at YEIDA, Uttar Pradesh.
• The facility, an Outsourced Semiconductor Assembly and Test (OSAT) unit, will be established with an investment of over 3,700 crore rupees under Semiconductor ATMP.
• This project marks a significant milestone for India's technological self-reliance and aims to position India as a global hub for electronics and semiconductor manufacturing.
• It aligns with government efforts to boost domestic manufacturing, reduce import dependence, and strengthen the global supply chain, supporting sectors like mobile phones, automotive, and consumer electronics.
• The initiative is expected to create thousands of direct and indirect employment opportunities and foster growth in India's semiconductor ecosystem through innovation and skill development.